A wafer used to fabricate cutting-edge, three-dimensional memory chips at the IM Flash plant in Lehi, Utah, operated by Intel Corp. and Boise’s Micron Technology Inc.
A wafer used to fabricate cutting-edge, three-dimensional memory chips at the IM Flash plant in Lehi, Utah, operated by Intel Corp. and Boise’s Micron Technology Inc. Jim McAuley The New York Times
A wafer used to fabricate cutting-edge, three-dimensional memory chips at the IM Flash plant in Lehi, Utah, operated by Intel Corp. and Boise’s Micron Technology Inc. Jim McAuley The New York Times

In 2016, Harvard sued Micron for patent infringement. Here’s what happened.

March 06, 2018 05:29 PM